As electronics become more powerful and compact, efficient heat dissipation is crucial for performance, safety, and longevity. Among the latest innovations in thermal interface materials (TIMs), Reworkable thermal gel have gained attention for ability to deliver consistent thermal conductivity while transitioning to demanding applications. https://connereukb47148.develop-blog.com/45006649/high-viscosity-thermal-gel-advanced-heat-management-for-electronics